June 22nd, 2015

CEA-Leti is hosting its 5th annual LetiDay San Francisco event, "Going Vertical with Leti: Solutions to new applications using 3D technologies", during SEMICON West.

In addition, Leti experts will share their insights on the MEMS market at TechXPOT North on July 14 and on lithography at the Semiconductor Technology Symposium (STS) on July 15.
The July 14 LetiDay event for invited guests is scheduled from 5-9 p.m. in the fourth-floor Social Terrace at the W San Francisco hotel, 181 3rd St.
Topics include:
· Welcome: Leti's 3D integration for tomorrow's devices, Leti CEO Marie Semeria
· CoolCubeTM: 3D sequential integration to maintain Moore's Law, Olivier Faynot, Leti Devices Department Manager
· Photonics: why 3D integration is mandatory, Olivier Faynot
· New non-volatile memory technologies, Hughes Metras, Vice President of Strategic Partnerships, North America
· Computing: 3D technology for better performance, Severine Cheramy, 3DIC Laboratory Manager
· Lighting: 3D integration for cost effectiveness, I. C. Robin, Strategic Marketing Manager, Lighting
· Nanocharacterization for 3D, Pierre Bleuet, 3D Imaging Expert
· Conclusion: Silicon ImpulseTM, Marie Semeria

Leti presentations at general sessions:
TechXPOT South, 10:30 a.m. to 12:30 p.m., July 14. Hughes Metras, Leti vice president for strategic partnerships/North America, will speak at the session on "What's Next for MEMS".

Semiconductor Technology Symposium (STS), 10 a.m. to 12:30 p.m., July 15, Moscone North, Hall E, Room 133. Laurent Pain, Leti patterning program manager – business development in the Silicon Technologies Division, will speak at the session on "Making Sense of the Lithography Landscape: Cost and Productivity Issues Below 14nm and the Path(s) to 5nm". His topic is "The Leverage of Lithography Alternatives to Address High-end Technology Roadmap".